July 01, 2026 | Case study | 5 minute read
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Data center liquid cooling solutions and technology for the next era of telecommunications infrastructure
Connectivity is no longer just a digital service — it is core infrastructure that it has to deliver more to keep the world moving. Every AI model trained, every cloud workload deployed, every video call and direct message depends on a physical foundation of data centers, networks and cables that must perform continuously, often under extreme weather conditions.
As technology advances, expectations rise for reliability, efficiency and scale. For telecom operators, data center designers, and network owners, telecommunications infrastructure must handle today’s loads and be designed to progressively adapt to future demand.
Dow’s role in this evolution is grounded in materials science expertise: enabling data center liquid cooling solutions, durable telecom cable compounds, and a broader ecosystem that supports performance across the full connectivity value chain.
Why heat is now a connectivity risk
The AI ecosystem and high-performance computing are driving unprecedented thermal density inside data centers. This demand means heat becomes a limiting factor not just for efficiency, but for uptime and hardware longevity. If heat is not managed effectively, it can constrain network performance, increase maintenance complexity, and limit future expansion.
One ecosystem, multiple heat management pathways
Our approach to telecommunications infrastructure is intentionally ecosystem‑based. Rather than focusing on a single product or portfolio, we offer multiple cooling solutions that can be combined and scaled over time:
- Direct-to-chip cooling: Using DOWFROST™ LC 25 Heat Transfer Fluid and DOWCAL™ 200E Heat Transfer Fluid to deliver reliable thermal performance and improved system efficiency.
- Immersion cooling: Enabled by DOWSIL™ Immersion Cooling Technology for high-speed, high-volume data communications.
- Thermally conductive compounds: Thermal interface materials (TIMs) work for a range of telecom, datacom and optical components.
- Primary loop HVAC: Powered by DOWFROST™ HD Heat Transfer Fluid, delivering robust corrosion protection and consistent operation in closed-loop systems.
- Operational support: The Dow Coolant Care Network simplifies fluid management through a coordinated network, improving consistency, reducing risk, and supporting reliable cooling system performance.
This integrated approach allows operators to evolve infrastructure incrementally — adapting to new workloads without systemic redesign.
Data center liquid cooling solutions: Keeping networks online at scale
Cooling solutions have shifted from a background utility to a mission‑critical system. This is why liquid cooling approaches are becoming central to modern data center design. Direct‑to‑chip cooling alongside immersion cooling is part of our flexible, multi‑pathway approach that enables operators to match cooling strategies to operational goals.
Direct‑to‑chip liquid cooling for high‑density computing
Direct-to-chip cooling is where a cooling fluid circulates through a closedloop system to remove heat directly from processors
DOWFROST™ LC 25 Heat Transfer Fluid is designed for these liquid cooling loops. As a direct-to-chip cooling fluid, it supports consistent heat transfer while helping protect system components. In high-availability environments such as hyperscale data centers and telecom, fluid reliability matters — not only for thermal performance, but also for long-term system integrity and maintenance planning.
By supporting controlled heat removal at the source, direct-to-chip cooling can help data centers operate within design limits as compute density increases without relying solely on higher airflow or larger mechanical systems.
Immersion cooling technology as a complementary pathway
As data center demands continue to accelerate, traditional cooling approaches are being pushed to their limits. Immersion cooling is emerging as a complementary pathway — enabling new levels of thermal efficiency by submerging electronic components directly in a dielectric fluid.
DOWSIL™ ICL-1100 Fluid is designed specifically for these environments. As part of our immersion cooling portfolio, it delivers efficient heat transfer while remaining compatible with sensitive electronic components, helping operators manage increasing power densities with confidence.
This approach opens up new possibilities for data center design, from supporting higher rack densities to enabling alternative facility layouts in locations where space or airflow constraints limit conventional air cooling.
Managing heat at the component level
While system-level cooling is essential, effective thermal management must also extend inside the hardware. Within telecom and datacom equipment, thermal interface materials (TIMs) play a critical role in transferring heat away from high-value, heat-sensitive components.
Dow’s silicone-based TIM solutions are engineered to deliver both thermal performance and reliability in demanding applications:
- DOWSIL™ TC-3065 Thermal Gel provides reliable thermal conductivity combined with mechanical stability — supporting consistent performance in complex electronic assemblies.
- DOWSIL™ TC-3120 Thermal Gel is optimized for optical transceivers and telecom modules, where stable thermal performance is essential to maintaining signal integrity and extending device lifetime.
Together, these materials help address heat where it matters most, at the component interface, supporting overall system reliability as data rates rise and power densities continue to increase.
Networks and cables: Reliability beyond the data hall
Data centers provide the engine for modern digital communications, but physical networks carry that connection to people and places in everyday life. Fiber and telecom cables must withstand weather, temperature extremes, mechanical stress, and long service lifetimes; often in environments that are difficult or costly to access.
AXELERON™ Telecom Cable Compounds are designed for insulation and jacketing applications that help protect telecom cables in demanding conditions. These telecom cable compounds support durability and longevity, helping network operators maintain consistent performance over time.
Robust cable materials can help reduce failure rates, support easier installation, and extend asset life — factors that directly affect network reliability and total cost of ownership.
Building data center and telecommunications infrastructure that performs and lasts
As connectivity becomes critical infrastructure, the materials that support it matter more than ever.
Whether enabling high-volume data communications, supporting edge networks, or extending fiber into harsh environments, materials that manage heat and protect assets help turn performance goals into operational reality. Flexible cooling pathways, data center liquid cooling solutions, and durable telecom cable compounds all play a role in building networks designed for long‑term performance.
The outcome is infrastructure, built for the future, that can scale with demand, maintain uptime under pressure, and operate more predictably over its lifecycle.
Frequently asked questions
Direct‑to‑chip cooling uses a liquid circulating through a closed loop to remove heat directly from processors, while immersion cooling submerges components in a dielectric fluid that absorbs heat across the system.
Liquid cooling helps manage higher heat loads from AI and high-performance computing by removing heat more efficiently than air, supporting reliable performance, uptime and scalability as computing density increases.
Telecom cable compounds help protect networks from environmental stress, mechanical damage, and aging while also helping maintain signal integrity and long‑term performance in demanding real‑world conditions.
About the article
This article was developed by a cross-discipline team representing global market expertise in connectivity data centers and telecommunications infrastructure. To explore other aspects of high-performance infrastructure solutions, visit dow.com.