Our heat transfer fluids are helping datacom companies around the globe achieve power usage effectiveness targets while taking on increasing heat loads.
The continuous advancement of micro-processor technology to support Artificial Intelligence, Internet-of-Things, and the overall acceleration of digital platforms has led to increasing heat loads incurred by Datacom Equipment Cooling Systems (DECS). Today, the majority of DECS are using air-cooling techniques, which is resource-intensive and not effective enough to deal with increasing heat loads. Given these trends, and as server rack densities approach and exceed 30 kW, the need for liquid cooled infrastructure is critical.
A hybrid approach to server cooling will be a likely solution inside an individual data center, with air and direct liquid cooling coexisting. “After years of collaboration with industry experts, Dow has launched DOWFROST™ LC Heat Transfer Fluid, specifically formulated for liquid cooled, ‘direct-to-chip’ applications”, said Jordan Rau, Marketing Manager for Heat Transfer Fluids.
DOWFROST™ LC provides the following benefits to customers who are making the switch to liquid cooling:
The migration from air cooling to liquid cooling is still in its infancy as many Data Centers are just now grappling with addressing the ever-increasing data loads on their servers. Additionally, these same companies are also facing societal pressures to reduce energy consumption and water usage. Thus, the need to move to a more efficient means of cooling becomes critical and innovative solutions such as direct-to-chip liquid cooling enabled by DOWFROST™ LC Heat Transfer Fluid can help meet those needs.
Dow has long been an industry leader within thermal management, providing high quality, long-lasting heat transfer fluids for nearly 90 years. We are committed to the continuous advancement of heat transfer-based technologies. Our heat transfer fluids are helping datacom companies around the globe achieve power usage effectiveness targets while taking on increasing heat loads.