Dow to feature industry-leading silicone solutions for the 5G ecosystem tomorrow at Productronica China 2021
Innovative technologies support manufacturing efficiency and environmental sustainability with end-to-end solutions for 5G networks
SHANGHAI, China – March 16, 2021 – Dow (NYSE: Dow) will highlight at Productronica China 2021 from March 17 – 19 in Hall E6, Booth #6550, three thermal management materials for the 5G ecosystem. These advanced silicones are part of a growing family of Dow products and include new DOWSIL™ TC-5550 High Reliable Thermal Grease, a pump-out resistance solution developed for bare die applications; DOWSIL™ TC-4083 Dispensable Thermal Pad, a product that combines long-term thermal stability with efficient gap filling and room temperature curing; and DOWSIL™ TC-3065 Thermal Gel, a material that can replace fabricated thermal pads and provide no oil bleeding issue and low levels of volatile organic compounds (VOCs).
Dow’s advanced silicone technologies efficiently dissipate the significant amounts of heat that are associated with 5G’s higher power densities and can support improvements in assembly efficiency and environmental sustainability. Visitors to the Dow booth at Productronica China 2021 can utilize interactive displays to learn more about the company’s featured products and its entire portfolio of silicone solutions for the 5G ecosystem. Jason Wei, technical service and development scientist at Dow, will discuss 5G ecosystem solutions during the show’s 5G Innovation Presentation Forum on Thursday, March 18 from 10:15 a.m. – 10:45 a.m. China Standard Time (CST).
“Demand for end-to-end solutions is expected to grow rapidly because of the continuing expansion of 5G networks, which includes consumer devices and technologies, telecommunications infrastructure, and cloud and data centers,” said Grace Zhang, global strategic marketer for Consumer Electronics at Dow. “Dow will help meet this demand by continuing to deliver new silicone-based technologies for the 5G ecosystem that combine reliable, long-lasting thermal performance with ease-of-dispensing and reduced energy consumption.”
New DOWSIL™ TC-5550 High Reliable Thermal Grease is designed for high performance processors (central processing units, discrete graphics processing units, field programmable gate arrays, and application-specific integrated circuit chips) that sometimes have to adopt a bare die architecture for better heat dissipation. When traditional thermal greases are used, these materials typically experience pump-out, an increase in thermal resistance caused by the loss of grease from the interface. DOWSIL™ TC-5550 High Reliable Thermal Grease avoids pump-out and prints easily onto heatsinks like a traditionalthermal grease. Moreover, Dow’s new solution contains no added solvents or processing aids to ensure reproducible properties over the product’s shelf life. This material also delivers performance stability that can withstand extended power cycling without pump-out for comparable performance to phase change materials (PCMs).
DOWSIL™ TC-4083 Dispensable Thermal Pad is an ultra-high thermal conductivity (>8W/mk) thermal interface material used for filling the gaps on printed circuit boards (PCBs) that have high power densities with powerful chips that generate more heat. Examples include 5G telecommunications base stations, high-performance computing units for cloud initiatives, and 5G networks for autonomous driving. Flame retardant DOWSIL™ TC-4083 Dispensable Thermal Pad dissipates high heat efficiently and maintains its thermal and mechanical properties after aging under harsh conditions. With its high extrusion rate and controlled viscosity, this product supports automatic dispensing or printing for production efficiency. This material cures at room temperature for reduced energy consumption, but accelerated curing can be achieved with the application of heat.
DOWSIL™ TC-3065 Thermal Gel can replace fabricated thermal pads in high-speed optical transceiver applications. This silicone gel contains extremely low levels of VOCs and has no silicone oil contamination issues due to its curable technology. DOWSIL™ TC-3065 Thermal Gel has a high thermal conductivity (6.5W/mk) and can provide high extrusion rates up to 65g/min for highly efficient production.
At Productronica China 2021, Dow’s interactive displays will demonstrate how the company’s featured products and other advanced silicones for the information and communications technology (ICT) industry are making a difference in 5G networks.
Dow’s portfolio of silicone technologies is available worldwide. To learn more, visit dow.com/electronics.
Dow (NYSE: DOW) combines global breadth, asset integration and scale, focused innovation and leading business positions to achieve profitable growth. The Company’s ambition is to become the most innovative, customer centric, inclusive and sustainable materials science company, with a purpose to deliver a sustainable future for the world through our materials science expertise and collaboration with our partners. Dow’s portfolio of plastics, industrial intermediates, coatings and silicones businesses delivers a broad range of differentiated science-based products and solutions for its customers in high-growth market segments, such as packaging, infrastructure, mobility and consumer care. Dow operates 106 manufacturing sites in 31 countries and employs approximately 35,700 people. Dow delivered sales of approximately $39 billion in 2020. References to Dow or the Company mean Dow Inc. and its subsidiaries. For more information, please visit www.dow.com or follow @DowNewsroom on Twitter.
For further information, please contact:
Eileen Zeng, Dow
Jo Duran, AH&M Inc.
Photo: Dow silicone solutions protecting and enhancing 5G technologies.