SINGAPORE – October 8, 2025, Dow (NYSE: DOW) will participate in Data Centre World 2025, from October 8th to 9th at Booth #112. Dow will spotlight the latest innovations in data center cooling solutions including thermal interface materials powered by DOWSIL™ silicones, direct-to-chip cooling - DOWFROST™ LC and immersion cooling fluids – DOWSIL™ ICL fluid.
“The proliferation of artificial intelligence (AI) and high-performance computing are contributing exponential growth in data workloads, and thermal management for data centers plays a critical role to ensure reliability, performance and energy efficiency. At Dow, innovation and sustainability go hand in hand. Dow is excited to participate in Data Centre World 2025, to engage and collaborate with industry leaders and partners on Dow’s cooling science solutions for data centers. Our data center cooling solutions will enable efficient, more sustainable and future-ready data infrastructure to meets the demands of next-generation computing.” said Cathy Chu, global strategic marketing director, Consumer & Electronics, Dow.
"As we continue to innovate and lead in the data center industry, our commitment to excellence remains strong. The DOWFROST™ LC Heat Transfer Fluid reflects our dedication to providing reliable solutions that ensure good performance and dependability. With its effective freeze protection, high-quality formulation, and ease of handling, we believe that our clients will experience improved efficiency and reduced maintenance downtime,” commented Eric Shao, marketing director, Industrial Solutions, Dow. “Our global capabilities and comprehensive service model further reinforce our promise to deliver significant value and support to our customers worldwide."
Dow’s Total Data Centre Cooling Solutions
As data centers grow in complexity and density, data centers’ cooling and heat dissipation require next-level performance and energy efficiency. To cater to the current and future demands of data centers and AI ecosystems, Dow provides a range of data center cooling solutions to help our customers reduce energy usage and improve performance:
- DOWSIL™ Thermal Interface Materials includes thermal gels, grease and gum solutions, engineered to meet the demands of high-performance computing environments to deliver long-lasting, reliable cooling across a wide range of applications.
- DOWSIL™ TC-3065 Thermal Gel and DOWSIL™ TC-3120 Thermal Gel are designed for 400G and 800G optical modules applications to dissipate heat, both are re-workable after curing, no oil-bleed and high reliability in high temperature and humidity conditions.
- DOWSIL™ TC-5960, DOWSIL™ TC-5888 Thermally Conductive Compound and DOWSIL™ TC 3080 Curable Thermal Gel are design for high-performance computing servers that can meet reliable, energy-efficient operation for GPUs and AI workloads.
- DOWFROST™ LC Heat Transfer Fluid is specifically formulated for liquid cooled, direct-to-chip applications and provides your system with exceptional corrosion protection, even in high surface area copper components.
- DOWSIL™ Immersion Cooling Liquid is a low-carbon solution with higher flash point of 200ºC*, uses single-phase immersion cooling technology and delivers optimal cooling and thermal management, while reducing costs and saving space.
Dow will be at Data Centre World 2025, Booth #112 (basement 2) with demonstrations and the latest information on data center cooling solutions, we are committed to connecting you with experts and resources to power the future of data centers together.
About Dow
Dow (NYSE: DOW) is one of the world’s leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, focused innovation, leading business positions and commitment to sustainability enable us to achieve profitable growth and help deliver a sustainable future. We operate manufacturing sites in 30 countries and employ approximately 36,000 people. Dow delivered sales of approximately $43 billion in 2024. References to Dow or the Company mean Dow Inc. and its subsidiaries. Learn more about us and our ambition to be the most innovative, customer-centric, inclusive and sustainable materials science company in the world by visiting www.dow.com.
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For further information, please contact:
Yi Qin, Ang
+65 8908 4362
yiqin@dow.com
Coco He
+86 21 38511623
che@dow.com